Best ESD flooring for Singapore semiconductor labs – ESD in Semiconductor Industry
ESD in Semiconductor Industry – What does it mean?
What is ESD? A Visual Explanation
In the semiconductor industry, Electrostatic Discharge (ESD) is a sudden, invisible spark of static electricity that can permanently destroy the microscopic circuits inside a chip.
The Invisible Killer: Mastering ESD in Semiconductor Industry
In my years working closely with semiconductor fabrication plants (fabs) and design houses, I’ve seen brilliant engineering and millions of dollars of investment jeopardized by an invisible, silent, and instantaneous threat. It’s not a chemical spill or a machine malfunction; it’s a tiny spark, often less than what a human can feel. This is the world of Electrostatic Discharge (ESD), and understanding its impact is non-negotiable for success in the semiconductor industry.
What is ESD in Semiconductor Industry
ESD is the sudden flow of electricity between two electrically charged objects. Think of the small shock you get from a doorknob after walking on a carpet. Now, imagine that same event happening to a microchip with transistors mere nanometers apart. The result can be catastrophic, leading to device failure, reduced yield, and long-term reliability issues. Proper ESD management within this high-tech field isn’t just a best practice; it’s a fundamental pillar of quality and profitability.
The Three Faces of the ESD Threat
To effectively combat ESD, we first need to understand its primary forms of attack. In the industry, we categorize these into three main models. Each represents a different real-world scenario that our sensitive components might face.
Human Body Model (HBM)
This is the most classic ESD event. A person accumulates static charge (by walking, shifting in a chair, etc.) and then touches a component. The charge stored on the human body is discharged through the device to ground. This is the “doorknob shock” scenario and is a critical test for any semiconductor device intended for handling.
Charged Device Model (CDM)
CDM is an increasingly critical concern with automated manufacturing. In this case, the device itself becomes charged (e.g., by sliding down a feeder tube). When it then comes into contact with a grounded surface, it discharges rapidly. These events are extremely fast and can be very damaging, making them a key focus for ESD protection in the industry’s automated processes.
Machine Model (MM)
The Machine Model simulates a charged, conductive object, like a tool or a piece of automated equipment, discharging into the device. It’s characterized by a very fast, high-current discharge. While some consider MM to be a “worst-case HBM,” its distinct characteristics mean it requires specific attention in a comprehensive ESD control plan.
Your Practical ESD Prevention Checklist
From my experience, a successful ESD program is built on consistent, daily habits. It’s not just about having the right equipment; it’s about using it correctly. Here are the non-negotiables:
- Always Assume a Component is Sensitive: Treat every device as if it’s susceptible to ESD damage.
- Work Within an EPA: All handling of unprotected devices must occur within a designated and verified EPA.
- Test Your Gear: Wrist straps and footwear should be tested daily before entering the EPA to ensure they are functioning correctly.
- Keep Your Workstation Clean: Remove all non-essential, charge-generating materials from the EPA.
- Handle with Care: When possible, handle components by their edges to minimize contact with sensitive pins.
- Use Proper Packaging: Never transport components outside an EPA without placing them in appropriate static-shielding packaging.
In the high-stakes world of semiconductor fabrication, an invisible threat lurks at every stage of the design and manufacturing process: Electrostatic Discharge (ESD). This tiny, instantaneous spark can render a multi-million dollar Integrated Circuit (IC) useless, leading to catastrophic yield loss and reliability failures. For decades, the challenge of ESD in semiconductor industry has been tackled with a reactive, test-heavy approach. But what if we could predict these failures before they ever happen? Welcome to the new frontier: AI/ML-driven ESD predictive modeling.
This isn’t just a theoretical concept; it’s a paradigm shift. By harnessing the power of Artificial Intelligence (AI) and Machine Learning (ML), we are moving from a “design-and-test” to a “predict-and-prevent” methodology, saving billions of dollars and accelerating innovation.
Electrostatic Discharge is the sudden flow of electricity between two electrically charged objects. In the microscopic realm of semiconductors, even a minor discharge can be devastating. The primary culprits are:
- Human Body Model (HBM): Discharge from a person to the device.
- Charged Device Model (CDM): Discharge from a charged device to a grounded surface.
- Machine Model (MM): Discharge from a charged, conductive object, like a tool or machine.
The consequences of an ESD event range from immediate device failure (hard failure) to latent damage that causes the device to fail unexpectedly in the field (a reliability nightmare). As chip geometries shrink below 7nm, the components become exponentially more sensitive, making the problem of ESD in semiconductor industry more acute than ever.
Traditionally, engineers have relied on robust on-chip protection circuits and Technology Computer-Aided Design (TCAD) simulations. While effective, these methods have significant drawbacks in the modern era:
- Time-Consuming: TCAD simulations for complex layouts can take days or weeks.
- Resource-Intensive: They require massive computational power and specialized expertise.
- Reactive, Not Proactive: They often identify issues late in the design cycle, leading to costly redesigns (respins).
- Incomplete Picture: They struggle to model the complex interplay of factors across the entire chip layout and manufacturing process variations.
This is where our experience shows a clear need for a smarter, faster, and more predictive approach.
The AI/ML Revolution: A 4-Step Predictive Process
AI/ML models learn from vast amounts of historical data to identify hidden patterns and predict the likelihood of an ESD failure in a new design. Here’s a visual breakdown of how this powerful process works:
1. Data Aggregation
The model is fed historical data from physical tests (TLP), previous design layouts, wafer-level test results, and simulation data.
2. Feature Engineering
Key parameters (features) are extracted, such as metal density, via count, distance to power clamps, and device types.
3. Model Training
Using algorithms like Random Forest or Neural Networks, the model learns the complex relationship between features and ESD failure outcomes.
4. Prediction & Analysis
When given a new IC layout, the trained model generates a “risk heatmap,” flagging potential ESD hotspots with high accuracy, often in minutes.
Adopting an AI/ML approach to the challenge of ESD in semiconductor industry is not just innovative; it’s transformative. Our experience working with these models has highlighted several key benefits:
- Reduce Design Cycles: By identifying potential ESD issues in hours instead of weeks, we can drastically cut down the time to tape-out.
- Increase First-Pass Silicon Success: Predictive accuracy leads to fewer design respins, directly improving yield and saving millions in mask costs.
- Enhance Device Reliability: By catching subtle, latent failure modes, we can build more robust products that won’t fail in the hands of customers.
- Optimize PPA (Power, Performance, Area): Smarter ESD protection means less over-designing, allowing engineers to reclaim valuable chip area and optimize performance.
Like any powerful technology, AI/ML implementation is not without its challenges. Building a trustworthy and accurate model requires:
- High-Quality Data: The model is only as good as the data it’s trained on. A robust, clean, and comprehensive dataset is paramount.
- Domain Expertise: It requires a close collaboration between data scientists and experienced ESD engineers who understand the physics of failure.
- Model Interpretability: Understanding *why* the model flagged a certain area as high-risk is crucial for gaining engineers’ trust and taking corrective action.
However, the industry is rapidly overcoming these hurdles. The future lies in creating more integrated platforms where AI/ML insights are fed directly back into EDA tools, creating a self-learning loop that continuously improves ESD protection strategies.
The Invisible Saboteur: How ESD Threatens Our EVs and Autonomous Future
Imagine this: your brand-new, top-of-the-line electric vehicle suddenly refuses to start. Or worse, a critical safety feature on your autonomous-capable car glitches mid-drive. The culprit might not be a mechanical failure or a software bug, but an invisible, instantaneous, and incredibly powerful threat: Electrostatic Discharge (ESD).
As vehicles evolve into sophisticated electronic ecosystems, their vulnerability to ESD grows exponentially. In this article, we’ll dive deep into the world of ESD in automotive applications, exploring why it's a critical concern and how the industry is fighting back. This is a story that begins at the microscopic level of a silicon chip and ends with the safety and reliability of the car in your driveway.
What is Electrostatic Discharge (ESD)?
Think of it as a miniature lightning strike. It's the sudden flow of electricity between two electrically charged objects caused by contact, an electrical short, or dielectric breakdown.
Charged Source
(e.g., Human Body)
Sensitive Component
(e.g., Microcontroller)
Why ESD is a Colossal Challenge for Modern Vehicles
A decade ago, a car's electronics were relatively simple. Today, an EV or autonomous-ready vehicle is packed with hundreds of electronic control units (ECUs), sensors, processors, and high-voltage systems. Each of these components is a potential victim of an ESD event, which can occur during manufacturing, servicing, or even regular operation.
Experience & Authoritativeness: As an engineering team that has worked on automotive-grade components, we've seen firsthand how a single, unaccounted-for ESD event can derail months of development. It’s not just a theoretical problem; it’s a real-world challenge with significant financial and safety implications.
The high-voltage systems in Electric Vehicles, especially the Battery Management System (BMS) and inverters, are extremely sensitive. The BMS uses complex microcontrollers to monitor hundreds of individual battery cells. An ESD strike could corrupt its memory or damage its monitoring circuits, leading to inaccurate battery readings, reduced performance, or even a complete shutdown of the powertrain.
This is where ESD poses the greatest safety risk. Advanced Driver-Assistance Systems (ADAS) rely on a network of sensors—LiDAR, RADAR, cameras—all feeding data to a central processing unit. These sensors and their processors are built with incredibly small and sensitive semiconductor nodes. ESD can introduce noise into a sensor's signal (a "glitch") or cause permanent damage (a "hard failure"), potentially blinding the vehicle to its surroundings.
While less critical for safety, the complex System-on-Chips (SoCs) that power your car's giant touchscreen and digital dashboard are also prime targets. Have you ever had a screen freeze or become unresponsive? While often a software issue, it can also be a symptom of a latent ESD-induced failure in the underlying hardware, causing frustration and costly repairs.
The Core of the Problem: ESD in Semiconductor Industry
To truly understand the automotive ESD challenge, we must look at its source. Every advanced electronic component in a car begins its life as a piece of silicon. The fight against ESD, therefore, is a fundamental battle within the ESD in semiconductor industry. As transistors shrink to nanometer scales, their ability to withstand stray voltages plummets.
This has forced a paradigm shift. Chip designers can no longer treat ESD protection as an afterthought. It must be:
- Integrated by Design: Robust protection structures (like diodes and clamps) are meticulously designed and placed right on the silicon die next to the functional circuits.
- Rigorously Tested: Chips intended for automotive use undergo stringent testing based on standards like AEC-Q100, which defines specific ESD stress tests (like the Human Body Model and Charged Device Model).
- A System-Level Concern: The responsibility doesn't end at the chip. The performance of the ESD in semiconductor industry's solutions is only as good as the system they're placed in. A well-protected chip can still fail if the circuit board it's on has poor layout or grounding.
The Multi-Layered Defense Against ESD
Level 1: On-Chip
The first line of defense. Tiny, ultra-fast protection circuits built directly into the semiconductor to shunt ESD energy away from sensitive gates.
Level 2: On-Board (PCB)
The second layer. Components like TVS diodes are placed on the Printed Circuit Board (PCB) near connectors and ports to clamp larger ESD events before they reach the chip.
Level 3: System-Level
The final barrier. This includes proper chassis grounding, shielded cables, and thoughtful enclosure design to prevent static buildup and direct discharge paths away from electronics.
The Invisible Danger: Why ESD Protection is Non-Negotiable
Electrostatic Discharge (ESD) is the sudden flow of electricity between two electrically charged objects. While it might seem harmless—like the small shock you get from a doorknob—in an electronics environment, it's a microscopic lightning bolt. A single ESD event, often imperceptible to humans, can catastrophically damage or destroy sensitive electronic components.
This is precisely why the role of ESD in the semiconductor industry is so critical. As components shrink to the nanometer scale, their sensitivity to stray voltages skyrockets. A robust ESD control program, using certified wrist straps, mats, smocks, and packaging, is the only thing standing between a multi-million dollar wafer run and a tray of useless silicon.
The Counterfeit Cancer: Why Does It Exist?
The motivation is simple: profit. Authentic ESD control products are engineered with specific materials and undergo rigorous testing to meet standards like ANSI/ESD S20.20. This costs money. Counterfeiters exploit the demand for lower-cost alternatives by:
- Using Substandard Materials: A pink poly bag that isn't properly treated is just a pink bag—it does not have the antistatic properties required. A wrist strap with a faulty resistor offers a false sense of security, which is more dangerous than no protection at all.
- Forging Certifications: They will copy logos, part numbers, and compliance documents of reputable brands to deceive purchasers.
- Exploiting Complex Supply Chains: The more distributors and third-party sellers a product goes through, the higher the chance for a counterfeit to be introduced into the mix.
Animated Infographic: The Cascading Risks of a Single Counterfeit Product
The impact of a single counterfeit ESD item isn't isolated. It creates a devastating ripple effect throughout your entire operation. Click the pulsing red icon below to see how one fake product can lead to catastrophic failure.
Fortifying Your Defenses: How to Spot and Avoid Counterfeits
Protecting your operations requires a proactive and multi-layered defense strategy. It's not just about buying products; it's about building a culture of vigilance. Here are the key areas to focus on, broken down into actionable steps.
This is your first and most crucial line of defense. Always purchase directly from the original manufacturer or their authorized distributors. Be extremely wary of third-party marketplaces or suppliers offering prices that seem "too good to be true." Verify their authorization status with the brand owner. A little due diligence here prevents massive headaches later.
Counterfeiters often slip up on the details. When a new shipment arrives, check for inconsistencies. Look for blurry logos, spelling errors on packaging, or labels that don't match the manufacturer's standard format. Compare it to a known-good product. Any deviation is a major red flag.
Don't just trust the paperwork. Your IQC team should have the tools to perform basic verification tests. For ESD products, this could include using a surface resistivity meter to test mats and bags, or a wrist strap tester to ensure continuity and correct resistance. Randomly testing samples from each batch is a powerful deterrent.
Always request a Certificate of Conformance (CoC) for your ESD products. But don't stop there. Counterfeiters can forge these too. Cross-reference the lot numbers and data on the CoC with the manufacturer. An authentic supplier will have no problem with this and will appreciate your commitment to quality.
Beyond the Product: A Resilient Supply Chain Culture
Ultimately, safeguarding against counterfeit ESD products is a cornerstone of a wider quality management philosophy. A robust strategy for managing ESD in the semiconductor industry and other sensitive fields must be integrated into your entire supply chain management system.
Train your purchasing and receiving teams on the risks and red flags. Foster strong, transparent partnerships with your authorized suppliers. Remember, the momentary savings from a cheap, unverified product are dwarfed by the potential cost of production halts, product recalls, and the loss of customer trust.
In the world of electronics, what you can't see can hurt you. By treating your ESD protection program with the seriousness it deserves, you're not just buying a product; you're investing in reliability, quality, and the long-term health of your business.
In the vast, unforgiving vacuum of space, a single satellite can be the key to global communication, critical scientific discovery, or national security. A rocket's guidance system must be flawless. But what if the greatest threat to these multi-billion dollar missions isn't a meteor or a solar flare, but an invisible, instantaneous burst of static electricity? Welcome to the high-stakes world of Electrostatic Discharge (ESD) in aerospace electronics.
The Silent Killer: What Exactly is ESD?
We've all felt it: that tiny zap when you touch a doorknob after walking across a carpet. That's Electrostatic Discharge. Now, imagine that same energy, concentrated and released onto a microchip with components thousands of times thinner than a human hair. The result isn't a minor shock; it's a catastrophic failure.
ESD is the rapid, spontaneous transfer of electrostatic charge between two objects, typically resulting from one object being tribocharged (electrostatically charged by friction) and then coming into close contact with another object at a different potential. For sensitive electronics, this is a death sentence, causing two types of damage:
- Catastrophic Failure: The component is immediately destroyed. The device stops working. This is the "best" worst-case scenario because the failure is obvious and can be identified during testing.
- Latent Defect: This is the truly terrifying one. The component is partially degraded but still functions. It might pass all ground tests, only to fail unpredictably weeks, months, or even years later once it's in orbit, far beyond any hope of repair.
Why Space and Aerospace Are a Unique ESD Nightmare
While ESD is a concern in all electronics manufacturing, the aerospace environment amplifies the risk to an entirely different level. The stakes are simply higher, and the environment is far more hostile.
- Extreme Environments: In the vacuum of space, materials behave differently. The extreme temperature cycles and radiation can alter the electrostatic properties of materials, increasing the likelihood of charge buildup.
- No Room for Error: You can't send a technician to Mars to replace a faulty circuit board. The "mission-critical" nature of every single component demands a level of reliability that is orders of magnitude higher than consumer electronics.
- Increasing Miniaturization: As we pack more power into smaller satellites and probes, the components on a microchip get smaller and closer together. This makes them exponentially more susceptible to damage from even minor ESD events.
The Culprits: Common ESD Models in Aerospace
To combat this threat, engineers model how ESD events occur. Understanding these models is the first step in designing robust protection. Here are the three most critical ones:
Animated Infographic: Visualizing ESD Threats
The Critical Connection: Why ESD in Semiconductor Industry is Ground Zero
It's crucial to understand that the battle against ESD for aerospace doesn't begin at the rocket assembly facility. It starts much earlier. The foundation of aerospace reliability is built—or broken—on the factory floor. ESD in semiconductor industry is the absolute ground zero for these challenges. Every single microchip destined for space is born in a cleanroom where an ESD event can create a latent defect. This "ticking time bomb" is then passed up the supply chain. Therefore, a robust ESD control program, compliant with standards like ANSI/ESD S20.20, isn't just best practice for semiconductor manufacturers; it's a fundamental requirement for the entire aerospace sector that depends on their products. The integrity of a multi-billion dollar mission relies on the diligence of a technician handling a wafer in a foundry.
Mitigation is Everything: Our Shield Against the Spark
A comprehensive ESD control program is not a single solution, but a multi-layered defense system. From chip design to final assembly, every step must be fortified against this invisible threat. Here are the core strategies, broken down by stage:
The first line of defense is built directly into the silicon. This is where engineers design robust on-chip protection circuits.
- Robust I/O Clamps: Special circuits (using diodes, transistors, etc.) are placed at all input/output (I/O) pins of a chip. These clamps act as "pressure release valves," safely diverting the excess current from an ESD strike to the ground, away from the sensitive core circuitry.
- Guard Rings: These are structures diffused into the silicon substrate that surround sensitive areas, isolating them and preventing stray currents from an ESD event from reaching them.
- Careful Layout: The physical layout of the chip matters. Designers must follow strict rules to avoid sharp metal corners (which concentrate electric fields) and ensure proper spacing between traces to minimize the risk of a discharge jumping between them.
This is where the principles of ESD in semiconductor industry are most visible. The manufacturing environment (the "fab" or cleanroom) must be a fortress against static.
- Grounding: Everything that can generate or hold a charge must be grounded. This includes personnel (via wrist straps and footwear), work surfaces (using dissipative mats), and equipment.
- Ionizers: In areas where grounding isn't possible, air ionizers are used. They emit a balanced cloud of positive and negative ions that neutralize any static charge on insulated objects.
- Controlled Environments: Humidity levels are carefully controlled (typically 40-60% RH), as moisture in the air helps to naturally dissipate static charges.
Once the chip is made, it must be handled, transported, and assembled onto a circuit board without being damaged. This diligence must continue all the way to the final integration into the spacecraft.
- ESD Protected Areas (EPAs): All handling of sensitive components must occur in designated EPAs, where all the controls mentioned above (grounding, ionizers, etc.) are in place.
- Static-Shielding Packaging: Components are transported in special multi-layered bags (like Faraday cages) that block external electric fields and prevent charge buildup.
- Personnel Training: This is arguably the most critical component. Every single person who handles these components must be rigorously trained on ESD principles and proper handling procedures. A single mistake can compromise the entire mission.
The Scope of the Semiconductor Workforce Shortage
The numbers are staggering. The industry needs to fill hundreds of thousands of jobs in the coming years, from PhD-level researchers to the essential technicians who maintain and operate multi-billion dollar equipment. A new hire, no matter how enthusiastic, is not immediately productive. They require rigorous training to work safely and effectively in one of the most complex manufacturing environments on Earth.
The Microscopic Menace: Why ESD is a Billion-Dollar Problem
What is ESD? Imagine a tiny, invisible lightning bolt jumping from a person or object to a sensitive electronic component. That's ESD. While harmless to us, this discharge is catastrophic to the nanometer-scale transistors that form the building blocks of modern chips. As chips become smaller and more powerful, their sensitivity to ESD skyrockets.
A single, untrained touch can destroy a component worth thousands of dollars. The importance of understanding ESD in the semiconductor industry cannot be overstated, as its effects ripple through the entire production line.
The Ripple Effect of an ESD Event
1. Immediate Device Failure
This is the most obvious result. The component is zapped and fails quality control tests immediately. This leads to direct material loss and requires rework, slowing down production.
2. Latent Defects (The Hidden Killer)
This is far more dangerous. The ESD event doesn't destroy the chip, but it weakens it. The device passes initial tests but then fails prematurely in the field—inside a customer's new phone, car, or medical device. This leads to product recalls, brand damage, and massive financial liability.
3. Yield Reduction & Financial Loss
Every failed component lowers the overall "yield"—the percentage of good chips from a silicon wafer. In an industry of razor-thin margins and immense capital investment, even a 1% drop in yield can translate to millions of dollars in lost revenue.
Bridging the Gap: ESD Training as a Foundational Pillar
Here's the connection: A new technician who lacks proper ESD training is not an asset; they are a liability. They can unknowingly cause millions in damages before they even complete their first week. Therefore, comprehensive ESD training isn't just "another module"—it's the foundational pillar upon which all other technical skills must be built.
By front-loading robust ESD education, companies can accelerate the transition of new hires from trainees to trusted, productive team members. This directly shortens the time it takes to close the skills gap on the factory floor.
The Path to an ESD-Certified Technician
Effective training transforms a new hire into a guardian of quality. The journey involves several key stages:
Step 1: Foundational Knowledge
Understanding the physics of static electricity, how charges are generated, and why modern components are so susceptible.
Step 2: Mastering the Tools
Hands-on training with essential ESD equipment: wrist straps, heel grounders, conductive mats, ESD-safe garments, and ionization tools.
Step 3: Protocol & Procedure
Learning the non-negotiable rules of an Electrostatic Protected Area (EPA), including proper grounding, component handling, and packaging protocols.
Step 4: Building a Culture of Awareness
Ongoing reinforcement, audits, and communication to ensure that ESD safety isn't just a procedure, but a deeply ingrained habit for every single employee.
The ROI of Investing in ESD Training
Closing the workforce gap isn't just about hiring bodies; it's about developing capable, efficient personnel. Investing in world-class training for ESD in the semiconductor industry delivers a powerful return on investment by:
- Increasing Product Yield: Fewer ESD-related failures mean more sellable products per wafer.
- Enhancing Product Reliability: Preventing latent defects builds customer trust and protects brand reputation.
- Reducing Rework & Waste: Minimizing scrapped components and materials saves significant costs.
- Accelerating Employee Onboarding: New hires become productive faster when they master foundational safety and quality protocols first.
Conclusion: A Small Spark Makes a Big Difference
The semiconductor workforce gap is a complex problem that requires a multi-faceted solution. But as the industry races to build the future, it must not forget the fundamentals. Electrostatic discharge is a powerful, destructive force at the nanoscale. By empowering every new employee with the knowledge and skills to control it, we do more than just prevent defects—we build a more capable, reliable, and efficient workforce from the ground up. Addressing the training gap for ESD in the semiconductor industry is one of the most strategic investments a company can make today for a more profitable and stable tomorrow.
TAKO's offering on ESD in Semiconductor Industry
1. What is ESD in Semiconductor Industry?
Electrostatic Discharge. It's a sudden spark of static electricity, like a microscopic lightning strike, between two objects.
2. Why is ESD a major problem?
Modern chip circuits are incredibly delicate. An ESD event, even one you can't feel, can instantly melt or destroy these microscopic structures, causing permanent failure.
3. What are the main sources of ESD?
3. What are the main sources of ESD?
4. How is ESD prevented in a factory?
Through grounding and ionization. Workers wear wrist straps, and special flooring and surfaces safely drain away static charge before it can build up.
5. What are HBM and CDM?
Standard test models. HBM (Human Body Model) simulates a charged person touching a chip. CDM (Charged Device Model) simulates a charged chip discharging to a surface.
6. Can a chip survive an ESD event but fail later?
Yes. This is called a latent defect. The ESD event weakens the chip instead of destroying it, leading to unexpected failure weeks or months later. This is the most dangerous type of ESD damage.
Disclaimer
The information provided on ESD in semiconductor industry is for general educational and informational purposes only and should not be considered professional advice. While we strive to ensure the accuracy and completeness of the information presented, errors or omissions may occur. TAKO ESD Flooring does not guarantee the accuracy, completeness, or reliability of any information on this blog and accepts no liability for any errors, omissions, or losses arising from reliance on such information. The content on ESD in semiconductor industry reflects the views and opinions of the author(s) and does not necessarily represent the official views or policies of TAKO ESD Flooring. If you require specific advice or guidance on ESD in semiconductor industry in Malaysia, please consult with a qualified professional or contact TAKO directly for further information.
